Global Die Bonder Equipment Market Size, Share, and COVID-19 Impact Analysis, By Type (Manual Die Bonders, Semiautomatic Die Bonders, and Automatic Die Bonders), By Application (Consumer Electronics, Automotive, Industrial, Telecommunications, and Others), and By Region (North America, Europe, Asia-Pacific, Latin America, Middle East, and Africa), Analysis and Forecast 2023 - 2033

Global Die Bonder Equipment Market Size Forecasts to 2033

• The Global Die Bonder Equipment Market Size was estimated at USD 1.81 Billion in 2023
• The Global Die Bonder Equipment Market Size is Expected to Grow at a CAGR of around 3.57% from 2023 to 2033
• The Worldwide Die Bonder Equipment Market Size is Expected to Reach USD 2.57 Billion by 2033
• North America is expected to grow the fastest during the forecast period.

The Global Die Bonder Equipment Market Size is expected to cross USD 2.57 Billion by 2033, growing at a CAGR of 3.57% from 2023 to 2033. The increasing demand for semiconductor integrated circuits, the expanding use of hybrid laptops, the popularity of high-definition television, and the advent of stacked die technology in Internet of Things (IoT) enabled products are all factors positive trend in die bonder equipment market.    

Market Overview

The business devoted to the production and supply of die bonding equipment, a crucial step in semiconductor packaging, is known as the die bonder equipment market. These devices use soft solder bonding, eutectic, and epoxy bonding to adhere semiconductor dies to substrates. The need for better semiconductor packaging, 5G technologies, and smaller devices is driving the market demand. AI-driven bonding solutions and automation advancements are driving growth in the die bonder equipment market.   

The market for die bonder equipment offers prospects in downsizing, automation, AI-powered bonding solutions, and 5G growth. The need for high-performance semiconductor packaging and developments in heterogeneous integration are driving growth. For instance, in May 2024, the ADAT3 XF twin revolve flip-chip die bonder, which ITEC launched, is revolutionizing the electronics manufacturing sector. According to reports, this state-of-the-art piece of machinery may work up to five times quicker than die bonders, which are present in the market.

Technological developments in die bonding, such as the creation of automated and semi-automated methods, are mostly driving the die bonder equipment market. The increasing need for semiconductor devices in a variety of industries, such as consumer electronics, healthcare, and automotive, is driving the market's exponential rise. The rising demand for tiny electronic components and the expanding use of stacked die technology in Internet of Things devices are two major factors driving the die bonder equipment market.

Report Coverage

This research report categorizes the die bonder equipment market based on various segments and regions forecasts revenue growth and analyzes trends in each submarket. The report analyses the key growth drivers, opportunities, and challenges influencing the die bonder equipment market. Recent market developments and competitive strategies such as expansion, type launch, development, partnership, merger, and acquisition have been included to draw the competitive landscape in the market. The report strategically identifies and profiles the key market players and analyses their core competencies in each sub-segment of the die bonder equipment market.   

Driving Factors

The necessity for more advanced, effective, and accurate die bonder equipment is highlighted by the move towards automation and the integration of artificial intelligence in manufacturing processes, which drives the die bonder equipment market's growth. The growing need for semiconductor devices across a range of industries, including consumer electronics, IT & telecommunications, and automotive, is primarily responsible for the market's present strong development. Technology advancements have made it possible for smaller businesses to establish themselves and grow their die bonder equipment market.     

The market is anticipated to develop more quickly due to the growing need for fully automatic die bonders for the assembly and packaging of large quantities of consumer products. The growing requirement for semiconductor components with greater processing capacity to effectively handle complicated algorithms and large datasets utilizing cutting-edge computing technologies, is driving the demand for precision die bonder equipment market.   

Restraining Factors

The market for die bonder equipment is restricted by supply chain interruptions, complicated integration issues, and expensive initial investment prices. Moreover, market development and the adoption of improved bonding methods are restricted by technological constraints, a lack of qualified personnel, and changing semiconductor demand.  

Market Segmentation

The die bonder equipment market share is classified into type and application.         

• The automatic die bonders segment held the largest share in 2023 and is expected to grow at a significant CAGR during the forecast period.  

Based on the type, the die bonder equipment market is divided into manual die bonders, semiautomatic die bonders, and automatic die bonders. Among these, the automatic die bonders segment held the largest share in 2023 and is expected to grow at a significant CAGR during the forecast period. The growing need for high accuracy and efficiency in the semiconductor production process is driving the expansion of the automatic die bonders industry. These devices, which have sophisticated features including high-speed bonding, flexibility in handling varied die sizes, and the capacity to work with a variety of substrates, are essential for the precise positioning of dies onto substrates.

• The telecommunications segment is anticipated to witness the fastest CAGR growth during the forecast period.

Based on the application, the die bonder equipment market is divided into consumer electronics, automotive, industrial, telecommunications, and others. Among these, the telecommunications segment is anticipated to witness the fastest CAGR growth during the forecast period. Rapid technical breakthroughs, such as the emergence of 5G and IoT, the growing number of smartphone users, and the demand for effective communication, are driving the telecommunications sector. Furthermore, the demand for high-performance semiconductor devices drives telecommunications applications.  

Regional Segment Analysis of the Die Bonder Equipment Market

• North America (U.S., Canada, Mexico) 
• Europe (Germany, France, U.K., Italy, Spain, Rest of Europe)
• Asia-Pacific (China, Japan, India, Rest of APAC)
• South America (Brazil and the Rest of South America) 
• The Middle East and Africa (UAE, South Africa, Rest of MEA)

Asia Pacific is anticipated to hold the largest share of the die bonder equipment market over the predicted timeframe.

Asia Pacific is anticipated to hold the largest share of the die bonder equipment market over the predicted timeframe. The thriving semiconductor industries in nations like China, South Korea, Japan, and Taiwan are responsible for the Asia Pacific expansion. The demand for die bonder equipment is expected to be driven over the forecast period by the significant demand for consumer electronics, the growing adoption of cutting-edge technologies like 5G, IoT, artificial intelligence (AI), and electric vehicles (EVs), as well as strong government support for semiconductor self-sufficiency and technological advancements.  

North America is expected to grow at the fastest CAGR growth of the die bonder equipment market during the forecast period. North America strong technical advancements, especially in the semiconductor and electronics industries, are driving the market for die bonder equipment in the region. The market's growth is further supported by elements such as the increase in demand for consumer electronics, the emergence of electric cars that need sophisticated semiconductor components, and the rising desire for smaller electronic gadgets.

Europe is predicted to hold a significant share of the die bonder equipment market throughout the estimated period. The European market for die bonder equipment is expanding steadily due to the region's emphasis on the industrial electronics, automotive, and healthcare industries. The need for die bonder equipment is rising as a result of Europe's dedication to innovation and sustainability, especially in the automotive industry, where the manufacture of electric vehicles is on the rise. This calls for sophisticated semiconductor components.

Competitive Analysis:

The report offers the appropriate analysis of the key organizations/companies involved within the die bonder equipment market along with a comparative evaluation primarily based on their type of offering, business overviews, geographic presence, enterprise strategies, segment market share, and SWOT analysis. The report also provides an elaborative analysis focusing on the current news and developments of the companies, which includes type development, innovations, joint ventures, partnerships, mergers & acquisitions, strategic alliances, and others. This allows for the evaluation of the overall competition within the market.  

List of Key Companies

• ITEC
• TRESKY GmbH
• West·Bond, Inc.
• Besi
• MRSI Systems
• Kulicke & Soffa Industries
• Shibuya Corporation
• ASM Pacific Technology
• Hybond Inc.
• Palomar Technologies
• Finetech GmbH & Co. KG
• SHINKAWA Electric Co., Ltd.
• MicroAssembly Technologies, Ltd.
• Others  

Key Target Audience

• Market Players
• Investors
• End-users
• Government Authorities 
• Consulting And Research Firm
• Venture capitalists
• Value-Added Resellers (VARs) 

Recent Development

• In April 2024, in West Lafayette, Indiana, SK Hynix announced a USD 3.87 billion commitment to build a state-of-the-art package fabrication and research and development center for AI products. This innovative project intends to improve the country's AI supply chain and is the first investment of its sort in the United States. A sophisticated semiconductor production line for next-generation HBM chips is anticipated to be included in the facility, with precision die bonder equipment used for assembly.   
• In September 2023, the high force die bonder MRSI-705HF was launched by MRSI Systems, a division of Mycronic Group. Based on the MRSI-705 platform, this new model has a heated bond head and can heat up to 400°C and deliver up to 500N of force. It's suited for applications such as sintering for power semiconductors and thermocompression bonding for advanced IC packaging.    

Market Segment

This study forecasts revenue at global, regional, and country levels from 2023 to 2033. Spherical Insights has segmented the die bonder equipment market based on the below-mentioned segments:   

Global Die Bonder Equipment Market, By Type

• Manual Die Bonders
• Semiautomatic Die Bonders
• Automatic Die Bonders

Global Die Bonder Equipment Market, By Application

• Consumer Electronics
• Automotive
• Industrial
• Telecommunications
• Others

Global Die Bonder Equipment Market, By Regional Analysis

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • France
  • Italy
  • Spain
  • Russia
  • Rest of Europe
• Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Australia
  • Rest of Asia Pacific
• South America
  • Brazil
  • Argentina
  • Rest of South America
• Middle East & Africa
  • UAE
  • Saudi Arabia
  • Qatar
  • South Africa
  • Rest of the Middle East & Africa