Top 50 Companies in Low-pressure Molding Material Market: Statistics Report Till 2035
RELEASE DATE: Sep 2025 Author: Spherical InsightsRequest Free Sample Speak to Analyst
Description
According to a research report published by Spherical Insights & Consulting, The Global Low-pressure Molding Material Market Size is projected to Grow from USD 1.2 Billion in 2024 to USD 2.87 Billion by 2035, at a CAGR of 8.25% during the forecast period 2025–2035. The growing need for electronics and automotive components that need to be effectively encapsulated and protected, developments in material science, and the growing trend of miniaturization across a number of industries are the main drivers of this strong growth.
Introduction
The growing electronics sector is a significant driver of the low-pressure molding material market. The necessity for dependable and effective encapsulation solutions that can shield delicate components from environmental elements like moisture, dust, and extreme temperatures has increased as modern electronics have become more complex and smaller. Low-pressure molding materials provide superior sealing qualities without causing harm to the sensitive electronics, making them perfect for these kinds of applications. Additionally, the market's expansion is being greatly aided by the automotive sector. Strong protection solutions are becoming more and more necessary as electronic components like sensors, control units, and battery management systems are being included in automobiles. In the automobile industry, low-pressure molding materials are used because they offer efficient insulation and sealing, guaranteeing the durability and dependability of car electronics under challenging working circumstances.
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Low-pressure Molding Material Market Size & Statistics
- The Market Size for Low-pressure Molding Material Was Estimated to be worth USD 1.2 Billion in 2024.
- The Market Size is Going to Expand at a CAGR of 8.25% between 2025 and 2035.
- The Global Low-pressure Molding Material Market Size is anticipated to reach USD 2.87 Billion by 2035.
- North America is expected to generate the highest demand during the forecast period in the Low-pressure Molding Material Market
- Asia-Pacific is expected to grow the fastest during the forecast period in the Low-pressure Molding Material Market.
Regional growth and demand
Asia-Pacific is expected to grow the fastest during the forecast period in the low-pressure molding material market. Over the course of the forecast period, Asia Pacific is anticipated to lead the market, with South Korea, Japan, and China playing a significant role. The region's market is growing because of its robust industrial base, especially in the electronics and automotive industries, as well as advantageous government regulations and reasonably priced labor. The need for low pressure molding materials in this region is further increased by the availability of raw materials and the tendency of outsourcing manufacturing activities to Asia Pacific.
North America is expected to generate the highest demand during the forecast period in the low-pressure molding material market. Another important market for low pressure molding materials is North America, which is fueled by the presence of major electronics and automobile manufacturers. The region's emphasis on technological innovation and developments, as well as the growing use of autonomous driving and electric vehicles, drives the need for dependable encapsulation solutions. Low pressure molding materials with sterilizing and biocompatibility features are also in greater demand due to the expanding medical devices sector in North America.
Top 5 trends in the Low-pressure Molding Material Market
- Shift toward sustainable and bio-based materials
- Accelerated adoption in electronics encapsulation
- Process automation and smart manufacturing integration
- Focus on energy and material efficiency
- Growth in automotive and e-mobility applications
1. Shift toward Sustainable and Bio-Based Materials
We're seeing a powerful transition as manufacturers prioritize sustainable, eco-friendly options think bio-based polyamides and recycled resins without sacrificing performance. This aligns not only with regulatory changes but also with customer demand for greener choices, positioning the industry to lead in both responsibility and innovation.
2. Accelerated Adoption in Electronics Encapsulation
Low-pressure molding is gaining traction for encapsulating sensitive electronics especially circuit boards and sensors because it gently protects delicate assemblies from moisture, vibration, and contaminants. As electronic devices shrink and grow more complex, manufacturers increasingly turn to LPM for its reliability and ability to extend product lifespan in harsh environments.
3. Process Automation and Smart Manufacturing Integration
Industry 4.0 is making its mark here: smart sensors, real-time monitoring, and automated controls are streamlining low pressure molding operations. These advancements not only boost production efficiency and turnarounds, but also enable manufacturers to maintain consistent quality, reduce waste, and implement predictive maintenance strategies.
4. Focus on Energy and Material Efficiency
Stakeholders are under pressure to drive costs down while reducing environmental impact. Low pressure molding responds with short cycle times and low scrap rates, using less raw material and consuming less energy than traditional processes, a compelling advantage in today’s price- and sustainability-sensitive markets.
5. Growth in Automotive and E-Mobility Applications
The ongoing electrification of transport has turbocharged demand for robust encapsulation of sensors, connectors, and power electronics in vehicles. As OEMs seek compact, reliable, and waterproof solutions, the automotive and e-mobility sectors are quickly becoming key growth engines for innovative low pressure molding materials
Empower your strategic planning:
Stay informed with the latest industry insights and market trends to identify new opportunities and drive growth in the low-pressure molding material market. To explore more in-depth trends, insights, and forecasts, please refer to our detailed report.
Top 25 Companies Leading the Low-pressure Molding Material Market
- Henkel AG & Co. KGaA
- Bostik (Arkema)
- Wacker Chemie AG
- LPMS (Low Pressure Molding Solutions)
- Ellsworth Adhesives
- Macromelt (part of Henkel)
- MoldMan Systems
- Nordson Corporation
- Optimel Schmelzgußtechnik GmbH
- H.B. Fuller
- 3M
- Adtek Malaysia
- Techsil Ltd
- Dongguan Yinshi Industrial Co., Ltd.
- Nitto Denko
- SUNTIP Industrial Limited
- Sanyu Rec Co., Ltd.
- KBM Advanced Materials
- LORD Corporation
- Guangzhou Kaihong Adhesives
- Fujifilm Corporation
- Taica Corporation
- Shenzhen Anbang Electric Co., Ltd.
- Technomelt (Henkel brand)
- Panacol-Elosol Gmb
1. Henkel AG & Co. KGaA — Düsseldorf, Germany
Henkel stands out as the powerhouse behind proprietary brands like TECHNOMELT and LOCTITE, raising the bar for low pressure molding material performance worldwide. The company’s polyamide-based solutions have become the industry standard for encapsulating electronics, offering excellent insulation, rapid cycle times, and protection from harsh environments. Henkel’s commitment to sustainability and innovation is visible in its push toward bio-based raw materials and streamlined processing. With global manufacturing and technical support, Henkel continues to set benchmarks, serving electronics, automotive, lighting, and medical sectors with materials that consistently deliver uncompromising reliability.
2. Bostik (an Arkema company) — Colombes, France
Bostik brings a chemistry-driven approach to low pressure molding, leveraging its strong adhesives legacy to deliver robust polyamide compounds for delicate electronics encapsulation. Known for adaptable formulations and responsive R&D support, Bostik enables manufacturers to address industry demands for lightweight, rapid, and environmentally aware solutions. Its materials are lauded for excellent flow characteristics and chemical resistance a must for automotive and electronic assemblies. Trusted by OEMs across numerous sectors, Bostik’s emphasis on customer partnership and material innovation positions it among the most influential players in the expanding LPM arena.
3. Wacker Chemie AG — Munich, Germany
Wacker Chemie has carved a reputation for specialty compounds in the low pressure molding market, especially within electronics and automotive electronics shielding. The company excels in developing thermoplastic resins with enhanced temperature and chemical stability giving engineers the confidence to push the envelope with their latest designs. Wacker’s collaborative R&D, stringent quality, and responsiveness to customer feedback make it a dependable partner for high-spec applications. As low-pressure molding gains momentum globally, Wacker’s specialized offerings help clients achieve both processing efficiency and enduring mechanical performance.
4. LPMS (Low Pressure Molding Solutions) — Taichung City, Taiwan
Blending agility with depth, LPMS delivers low-pressure molding equipment, materials, and contract manufacturing under one roof making it a go-to partner for rapid development and scalable production. LPMS is especially renowned for its versatile tooling capabilities, allowing clients to customize processes for everything from LED encapsulation to high-volume sensor protection. By also distributing major brands like Henkel’s TECHNOMELT, LPMS offers a holistic and responsive service model. Global manufacturers rely on LPMS for both tailored solutions and a strong commitment to process and design innovation.
5. Ellsworth Adhesives — Germantown, Wisconsin, USA
Ellsworth Adhesives bridges the gap between materials engineering and hands-on manufacturing, pairing a comprehensive portfolio including Henkel’s trusted polyamides with dedicated low pressure molding services. Their team provides technical consulting, prototyping, and full-scale production, supporting manufacturers throughout the product lifecycle. Ellsworth is recognized for its solution-oriented approach, ensuring that customers in the automotive, electronics, and medical sectors receive rapid guidance and reliable supply. With a finger on the pulse of the industry’s evolving needs, Ellsworth continues to enable seamless integration of advanced LPM technologies into real-world applications.
Are you ready to discover more about the low-pressure molding material market?
The report provides an in-depth analysis of the leading companies operating in the global low-pressure molding material market. It includes a comparative assessment based on their product portfolios, business overviews, geographical footprint, strategic initiatives, market segment share, and SWOT analysis. Each company is profiled using a standardized format that includes:
Company Profiles
- Henkel AG & Co. KGaA
- Business Overview
- Company Snapshot
- Products Overview
- Company Market Share Analysis
- Company Coverage Portfolio
- Financial Analysis
- Recent Developments
- Merger and Acquisitions
- SWOT Analysis
- Bostik (Arkema)
- Wacker Chemie AG
- LPMS (Low Pressure Molding Solutions)
- Ellsworth Adhesives
- Macromelt (part of Henkel)
- MoldMan Systems
- Nordson Corporation
- Optimel Schmelzgußtechnik GmbH
- Others.
Conclusion
The Low-Pressure Molding Material Market Size is experiencing dynamic growth, driven by the electronics, automotive, and medical sectors’ increasing demand for reliable and efficient encapsulation solutions. As manufacturers push the boundaries of miniaturization, automation, and sustainability, low pressure molding stands out with its ability to protect sensitive components while streamlining production and reducing environmental impact. Ongoing trends such as the use of bio-based materials, integration of smart manufacturing, and emphasis on lightweight designs point to a future of more agile and eco-friendly manufacturing. With a robust pipeline of innovation and strong industry adoption, this market is well-positioned for sustained expansion.
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