Discover Top 20 Companies in Chip Scale Adhesive Market: Global Share, Market Size, Revenue Report (2024–2035)
RELEASE DATE: Sep 2025 Author: Spherical InsightsRequest Free Sample Speak to Analyst
Description
According to a research report published by Spherical Insights & Consulting, The Global Chip Scale Adhesive Market Size is projected to Grow from USD 1.63 Billion in 2024 to USD 4.11 Billion by 2035, at a CAGR of 8.77% during the forecast period 2025–2035. This expansion is mainly fueled by the rising need for compact electronic devices, progress in adhesive technologies, and the growing use of chip-scale packages (CSP) across multiple sectors. The need for dependable and efficient adhesives is essential for maintaining the durability and effectiveness of microelectronic components, which in turn drives the market forward.
Introduction
The Chip Scale Adhesive Market Size is a specific sector within the larger adhesives industry that concentrates on high-performance bonding agents utilised in microelectronic packaging. These adhesives are designed to fulfil the strict requirements of chip-scale packaging (CSP), in which electronic components are shrunk and combined into small devices. Chip scale adhesives are unique adhesive substances utilised in semiconductor packaging, specifically formulated for attaching and encasing very tiny semiconductor devices known as chip scale packages (CSPs). The chip scale adhesive market is expanding quickly, driven by rising demand for smaller, quicker, and more efficient consumer electronics, automotive electronics, telecommunications, and healthcare devices. Sophisticated adhesive formulations such as epoxies, silicones, and polyurethanes are fine-tuned for thermal conductivity, electrical insulation, and durability against moisture and impurities.
Navigate Future Markets with Confidence: Insights from Spherical Insights LLP
The insights presented in this blog are derived from comprehensive market research conducted by Spherical Insights LLP, a trusted advisory partner to leading global enterprises. Backed by in-depth data analysis, expert forecasting, and industry-specific intelligence, our reports empower decision-makers to identify strategic growth opportunities in fast-evolving sectors. Clients seeking detailed market segmentation, competitive landscapes, regional outlooks, and future investment trends will find immense value in the full report. By leveraging our research, businesses can make informed decisions, gain a competitive edge, and stay ahead in the transition toward sustainable and profitable solutions.
Unlock exclusive market insights-Download the Brochure now and dive deeper into the future of the Chip Scale Adhesive Market.
Chip Scale Adhesive Market Size & Statistics
- The Market Size for Chip Scale Adhesive Was Estimated to be worth USD 1.63 Billion in 2024.
- The Market Size is Going to Expand at a CAGR of 8.77% between 2025 and 2035.
- The Global Chip Scale Adhesive Market Size is anticipated to reach USD 4.11 Billion by 2035.
- Asia Pacific is anticipated to generate the highest demand during the forecast period in the chip scale adhesive market.
- North America is projected to grow at the fastest CAGR during the forecast period in the chip scale adhesive market.
Regional growth and demand
North America is anticipated to grow the fastest during the forecast period in the chip scale adhesive market.
North America represents another key market for chip scale adhesives, propelled by technological advancements and the growing use of smart devices and electric cars. The existence of prominent technology firms and car manufacturers in the United States and Canada fosters market expansion in this area. The area is expected to experience significant expansion, fueled by continuous research and development efforts and the increasing emphasis on sustainable and high-performance adhesive products.
Asia Pacific is expected to generate the highest demand during the forecast period in the chip scale adhesive market.
The local market is fueled by the existence of significant semiconductor manufacturing centres like China, Taiwan, South Korea, and Japan. The regional market is booming due to the expansion of the consumer electronics industry, along with substantial investments in the automotive and aerospace fields, which enhances its market standing even more.
Top 10 trends in the Chip Scale Adhesive Market
- Increased Demand for Miniaturised and High-Density Electronics
- Growth in Semiconductor and MEMS Applications
- Advanced Material Formulations
- Rising Popularity of Fast-Curing and Low-Temperature Adhesives
- Focus on Sustainability and Low-VOC Formulations
- Automated and Precision Dispensing Technologies
- Customisation for Emerging 5G and AI Applications
- R&D in Nanotechnology-Enhanced Adhesives
- Stringent Reliability and Testing Standards
- Expansion in Asia-Pacific Manufacturing Base
1. Growth in Semiconductor and MEMS Applications
Increased application of chip scale adhesives for microelectromechanical systems (MEMS), flip-chip bonding, and advanced integrated circuits fosters innovation in sensors and automotive electronics.
2. Rising Popularity of Fast-Curing and Low-Temperature Adhesives
The demand for quicker production cycles is driving the use of UV-curable, snap cure, and low-temperature adhesives for effective, high-speed semiconductor assembly.
3. Automated and Precision Dispensing Technologies
Automation in adhesive application, such as jetting, stencil printing, and robotic dispensing, enhances precision and efficiency in semiconductor packaging lines with high volume.
4. Customisation for Emerging 5G and AI Applications
Specialized adhesives designed for high frequency, low-loss, and thermal regulation characteristics are facilitating the increasing demands of 5G, AI, and fast computing devices.
5. R&D in Nanotechnology-Enhanced Adhesives
Investigation of adhesives enhanced by nanomaterials seeks to improve adhesion strength, dependability, and functionality for future chip scale packages.
Empower your strategic planning:
Stay informed with the latest industry insights and market trends to identify new opportunities and drive growth in the chip scale adhesive market. To explore more in-depth trends, insights, and forecasts, please refer to our detailed report.
Top 20 Companies Leading the Chip Scale Adhesive Market
- Henkel AG & Co. KGaA
- 3M Company
- Dow Inc.
- H.B. Fuller Company
- Bostik SA
- Avery Dennison Corporation
- Sika AG
- Ashland Global Holdings Inc.
- Master Bond Inc.
- Dymax Corporation
- Permabond LLC
- LORD Corporation
- Panacol-Elosol GmbH
- DELO Industrial Adhesives
- Epoxy Technology Inc.
- Mitsubishi Chemical Corporation
- Toray Industries, Inc.
- Shin-Etsu Chemical Co., Ltd.
- Huntsman Corporation
- Wacker Chemie AG
- Others
1. Henkel AG & Co. KGaA
Headquarters: Düsseldorf, Germany
Henkel is a significant and direct competitor in the chip scale adhesive market via its Adhesive Technologies division. This market is an essential part of the larger electronics and semiconductor adhesives market. Henkel's position relies on its broad product range, profound technical knowledge, and established connections with clients in the electronics sector. Henkel provides an extensive selection of top-quality adhesives designed specifically for semiconductor packaging and electronic assembly. These consist of die attach adhesives, underfill compounds, and encapsulation substances. In the chip scale adhesive market, which pertains to attaching components nearly the same size as the silicon die.
2. 3M Company
Headquarters: Maplewood, Minnesota, USA
3M is a major participant in the chip scale adhesive sector, mainly serving as a provider of highly specialised materials for the electronics and semiconductor fields. Although some companies concentrate on liquid adhesives for die attach and underfill, 3M stands out notably in the field of advanced packaging process safeguarding. The firm provides specialised tapes, including 3M Heat Resistive Polyimide Tapes, designed to safeguard components during high-temperature procedures such as solder reflow. These tapes are essential in Wafer-Level Chip Scale Packaging (WLCSP) and various sophisticated packaging techniques.
3. Dow Inc.
Headquarters: Midland, Michigan, USA
Dow Inc. plays a direct and crucial role in the chip scale adhesive sector via its Performance Materials & Coatings division, concentrating particularly on silicone-based products. The company's function relies on its extensive knowledge of silicone chemistry, essential for advanced electronic applications. Dow offers a variety of high-performance adhesives and sealants for the electronics sector under its DOWSIL brand. These products are designed specifically to fulfil the rigorous standards of semiconductor packaging, such as chip scale packages (CSPs). Its robust stance in silicone-based solutions for electronics provides a considerable edge, especially in areas where thermal management and stress relief are essential
4. H.B. Fuller Company
Headquarters: St. Paul, Minnesota, USA
H.B. Fuller is a crucial and direct participant in the chip scale adhesive sector. The Engineering Adhesives division of the company delivers high-performance adhesives for challenging applications, such as those in the electronics and semiconductor sectors. H.B. Fulle's function relies on its capacity to offer a diverse array of specialised adhesives that address the specific challenges of miniaturisation and sophisticated packaging. H.B. Fuller provides an extensive selection of adhesives tailored for the electronics industry, featuring items specifically made for chip scale and semiconductor packaging.
5. Bostik SA
Headquarters: Colombes, France
Bostik is a direct player in the chip scale adhesive market, a segment of the broader industrial adhesives market. While the company is well-known for its construction and consumer products, it also has a dedicated focus on industrial solutions, including those for the electronics and advanced packaging industries. Industrial Solutions and Engineering Adhesives: Bostik's business is organised to serve various industrial markets, including assembly and engineering adhesives, which are directly related to the electronics and semiconductor sectors. The company's focus in these areas is on providing high-performance bonding solutions for demanding applications.
Are you ready to discover more about the chip scale adhesive market?
The report provides an in-depth analysis of the leading companies operating in the global chip scale adhesive market. It includes a comparative assessment based on their product portfolios, business overviews, geographical footprint, strategic initiatives, market segment share, and SWOT analysis. Each company is profiled using a standardized format that includes:
Company Profiles
- Henkel AG & Co. KGaA
- Business Overview
- Company Snapshot
- Products Overview
- Company Market Share Analysis
- Company Coverage Portfolio
- Financial Analysis
- Recent Developments
- Merger and Acquisitions
- SWOT Analysis
- 3M Company
- Dow Inc.
- H.B. Fuller Company
- Bostik SA
- Avery Dennison Corporation
- Sika AG
- Ashland Global Holdings Inc.
- Master Bond Inc.
- Dymax Corporation
- Permabond LLC
- LORD Corporation
- Panacol-Elosol GmbH
- DELO Industrial Adhesives
- Epoxy Technology Inc.
- Mitsubishi Chemical Corporation
- Toray Industries, Inc.
- Shin-Etsu Chemical Co., Ltd.
- Huntsman Corporation
- Wacker Chemie AG
- Others
Conclusion
The Chip Scale Adhesive Market Size is anticipated to grow from USD 1.63 billion in 2024 to USD 4.11 billion by 2035, driven by robust demand for high-performance adhesives in the areas of microelectronics and semiconductor packaging. The Asia Pacific region dominates market share, while North America is expected to experience the highest CAGR, fueled by advancements in technology and innovations in smart devices and automotive electronics. These firms establish benchmarks by providing sophisticated adhesives designed for semiconductor, MEMS, 5G, and automotive electronics packaging—offering features like quick curing, thermal and electrical regulation, low-VOC options, and assistance for automated dispensing methods. The competition features strategic investments, patent advancements, market growth in the Asia Pacific, and continuous initiatives to improve reliability, miniaturisation, and operational efficiency in chip-scale electronic production.
About the Spherical Insights & Consulting
Spherical Insights & Consulting is a market research and consulting firm which provides actionable market research study, quantitative forecasting and trends analysis provides forward-looking insight especially designed for decision makers and aids ROI.
Which is catering to different industry such as financial sectors, industrial sectors, government organizations, universities, non-profits and corporations. The company's mission is to work with businesses to achieve business objectives and maintain strategic improvements.
CONTACT US:
For More Information on Your Target Market, Please Contact Us Below:
Phone: +1 303 800 4326 (the U.S.)
Phone: +91 90289 24100 (APAC)
Email: inquiry@sphericalinsights.com, sales@sphericalinsights.com
Contact Us: https://www.sphericalinsights.com/contact-us
Need help to buy this report?