Global Industrial Electronics Packaging Market Insights Forecasts to 2032
- The Global Industrial Electronics Packaging Market Size was valued at USD 2.13 Billion in 2022.
- The market Size is Growing at a CAGR of 4.94% from 2022 to 2032
- The Worldwide Industrial Electronics Packaging Market Size is expected to reach USD 3.45 Billion by 2032
- Asia Pacific is expected to Grow the fastest during the forecast period
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The Global Industrial Electronics Packaging Market Size is expected to reach USD 3.45 Billion by 2032, at a CAGR of 4.94% during the forecast period 2022 to 2032.
Electronic packaging refers to the design and manufacture of containers for electronic gadgets, which can range from standalone semiconductor parts up to full systems like a mainframe computer. The components such as drives, sensors, and switches are included in industrial electronics systems, as are sophisticated power conversion technologies, PLCs, and robotics. The industrial revolution is becoming progressively technological, and the industrial electronic packaging industry is observing an increase in IoT use. The packaging sector, which seeks to support innovative electronic packaging solutions, is anticipated to be impacted by the trend towards digitalization covers control system methods and processes, instrumentation, mechanism and diagnosis, signal processing, and automation of diverse industrial applications. In addition, an important portion of the market under consideration is accounted for by the automotive industry, primarily as a result of the growing popularity of electric vehicles (EVs) and hybrid cars. The demand is anticipated to increase quickly throughout the projected period because of the large number of electronic devices, processors, analog circuits, discrete power devices, and sensors utilized in electric and hybrid cars. Furthermore, to maintain safety and preserve commodities and products from damage or contamination, industrial packaging is utilized for advertising and branding. Industrial packaging is labeled in a manner similar to commercial packaging used by some companies, which serves to increase brand awareness and attention. Custom-painted drums, cartons, and containers can all be labeled with a company's brand.
Global Industrial Electronics Packaging Market Report Coverage
|Market Size in 2022:||USD 2.13 Billion|
|Forecast Period 2022-2032 CAGR:||4.94%|
|2032 Value Projection:||USD 3.45 Billion|
|Historical Data for:||2018-2021|
|No. of Pages:||200|
|Tables, Charts & Figures:||100|
|Segments covered:||By Material Type, By Packaging Type, By Protection Level, By Application, By Region and COVID-19 Impact Analysis|
|Companies Covered:||UFP Technologies Inc., Sealed Air Corporation, Achilles Corporation, Desco Industries Inc., Botron Company Inc., Kiva Container Corporation, Orlando Products Inc., Delphon Industries LLC, Summit Container Corporation, Protective Packaging Corporation, Dou Yee Enterprises (S) Pte Ltd., Dordan Manufacturing Company Inc., DS Smith Plc., Smurfit Kappa Group Plc., and Others.|
|Pitfalls & Challenges:||COVID-19 Empact, Challenges, Future, Growth, & Analysis|
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The increased usage of consumer electronic products such as smartphones, tablets, smart TVs, and digital cameras that include novel packaging materials such as air bubble wraps and air pillows to protect against harsh weather conditions is driving market expansion. Further driving the growth of the electronic packaging market is the demand for all-weather protective packaging for delicate electronic products like routers, network servers, and sensors. However, potential reliability problems as a result of load as well as complexity and asking for maintenance of issues after components are soldered onto the circuit board tend to limit market expansion.
Electronic packaging is a significant area in mechanical engineering. The cost of the packaging is pressure on electronics manufacturers is constant, especially raw material costs, transport expenses, and packaging costs. It is difficult to balance affordability with both performance and quality. In order to meet the requirements of the latest devices, packaging must keep up with the latest rising technologies such as 5G, IoT, and AI. Supply chain disruptions may lead to delays in procuring packaging materials and disrupt production schedules. As a result, the high-end pricing and risks associated with Industrial electronics packaging may reduce acceptability, limiting business development.
By Material Type Insights
The plastic segment dominates the market with the largest revenue share over the forecast period.
On the basis of material type, the global Industrial electronics packaging market is segmented into plastics, composites, metals, and ceramics. Among these, the plastic segment is dominating the market with the largest revenue share of 35.6% over the forecast period. Plastics and polymers are adaptable and ideal for a variety of package designs, including flexible and customized shapes, in addition to their vast range of formulas. Plastics and polymers are perfect for electronic components because they are lightweight, especially in uses where reduced weight is essential. Additionally, rising usage will accelerate segmental expansion even more.
By Packaging Type Insights
The rigid segment is witnessing significant CAGR growth over the forecast period.
On the basis of the packaging type, the global Industrial electronics packaging market is segmented into rigid and flexible. Among these, the rigid segment is witnessing significant CAGR growth over the forecast period. It provides structure and support for packaging products and is in high demand for its strength, durability, and barrier qualities. This packaging has significance for long-distance shipping since it keeps the products safer for longer.
By Protection Level Insights
The standard packaging segment is expected to hold the largest global industrial electronics packaging market share during the forecast period.
On the basis of the protection level, the global Industrial electronics packaging market is segmented into electromagnetic interference shielding, hermetic packaging, standard packaging, and electrostatic discharge packaging. Among these, the standard packaging segment is witnessing significant CAGR growth over the forecast period. Packaging for industrial electronics must be able to endure mechanical shocks and vibrations in situations that are tough as automotive, aircraft, and heavy equipment. Standard packaging gives protection from structural harm, temperature, electromagnetic noise emission, and electric discharge must all be taken into account when packaging electronic equipment.
By Application Insights
The semiconductor segment accounted for the largest revenue share of more than 33.85% over the forecast period.
On the basis of application, the global Industrial electronics packaging market is segmented into semiconductor packaging, power electronics packaging, industrial control systems packaging, telecommunications equipment packaging, automation, and robotics equipment packaging. Among these, the semiconductor segment dominates the market with the largest revenue share of 33.85% over the forecast period. Packaging solutions that can survive the intense vibrations and mechanical pressures encountered are required by the semiconductor sector. Manufacturing and design semiconductors both require packaging. On a macro level, it impacts power, performance, and cost, whereas on a micro level, it affects the basic functionality of all processors.
North America dominates the market with the largest market share over the forecast period.
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North America is dominating the market with more than 38.12% market share over the forecast. The electronics sector in the US is reliable and powerful on a worldwide scale. The United States is a top producer globally in the presence of significant industrial electronics packaging firms. The United States produces a lot of industrial electronics packaging on account of components like high consumer electronics demand, growing technology development, and technical developments. Industrial electronics packaging shipments are also anticipated to increase as a result of rising demand for next-generation electronic devices in many industries. Sales of various industrial electronic components are anticipated to increase along with the rising trend of automation.
Asia Pacific, on the contrary, is expected to grow the fastest during the forecast period. China is dominating the product segment of the rising demand for electronic devices such as tablets, smartphones, and other consumer electronics and the cost reductions and improved efficiency that smart packaging provides.
List of Key Market Players
- UFP Technologies Inc.
- Sealed Air Corporation
- Achilles Corporation
- Desco Industries Inc.
- Botron Company Inc.
- Kiva Container Corporation
- Orlando Products Inc.
- Delphon Industries LLC
- Summit Container Corporation
- Protective Packaging Corporation
- Dou Yee Enterprises (S) Pte Ltd.
- Dordan Manufacturing Company Inc.
- DS Smith Plc.
- Smurfit Kappa Group Plc.
Key Market Developments
- On October 2021, Verzuolo produced recycled containerboard, and Smurfit Kappa Group announced that it had successfully acquired it for USD $382.53 million.
This study forecasts revenue at global, regional, and country levels from 2020 to 2032. Spherical Insights has segmented the global Industrial electronics packaging market based on the below-mentioned segments:
Industrial Electronics Packaging Market, Material Type Analysis
Industrial Electronics Packaging Market, Packaging Type Analysis
Industrial Electronics Packaging Market, Protection Level Analysis
- Electromagnetic Interference shielding
- Hermetic Packaging
- Standard Packaging
- Electrostatic Discharge Packaging
Industrial Electronics Packaging Market, Application Analysis
- Semiconductor Packaging
- Power Electronics Packaging
- Industrial Control Systems Packaging
- Telecommunications Equipment Packaging
- Automation and Robotics Equipment Packaging
Industrial Electronics Packaging Market, Regional Analysis
- North America
- Rest of Europe
- Asia Pacific
- South Korea
- Rest of Asia Pacific
- South America
- Rest of South America
- Middle East & Africa
- Saudi Arabia
- South Africa
- Rest of Middle East & Africa
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